1. Before BGAA soldering, the circuit board must be baked to prevent deformation caused by BGA heating. 2. Remove the adhesive from the chip before soldering. Before planting BGA chips, the solder paste should be evenly applied and as thin as possible. Before starting the heating process, preheat the entire chip 5. There are differences in printed boards, and different heating temperatures are used for actual soldering. The brightness of the solder balls is used as the criterion in actual situations. When welding, it is best to use a nozzle larger than the chip for welding. 7. After the chip is heated, external objects such as alcohol lamps should not be used to quickly cool it down to prevent explosions. 8. Attention should be paid to preventing oxidation of solder wires and solder balls.
