The meaning of BGA BGA means chips packaged using BGA packaging technology. There are four basic types of BGA: PBGA, CBGA, CCGA, and TBGA, which are generally connected to the bottom of the package as solder ball arrays for I/O output terminals BGA soldering station BGA soldering station, also known as BGA rework station, is a specialized equipment used when BGA chips have soldering problems or need to be replaced with new BGA chips Classification of BGA soldering stations 1. Manual low-end models: suitable for BGA chip repair with a large pitch (0.6 or more) between BGA solder balls. 2. Semi automatic optical alignment model: Using the principle of optical alignment to avoid errors in surface mounting. 3. Fully automatic machine vision alignment model: Based on the high-tech technology of machine vision alignment, a fully automatic repair process is achieved The determining factors for choosing BGA soldering stations: 1. The size of the circuit board that needs to be repaired; 2. The size of the chip that needs to be soldered 3. Size of power supply Requirements for BGA soldering stations: Is there only three constant temperature zones; 2. Can the upper and lower heating heads be moved; 3. Does it have only curve settings; 4. Whether it has welding function; 5. Whether it has cooling function; 6. Is there a built-in vacuum pump Reliability, testability, and ease of use of the equipment 1. The equipment should have safety protection functions, such as preventing safety accidents in the event of thermocouple, fan, or heating device failure. 2. The material selection of equipment components must be excellent and the wiring must be standardized. 3. The device has self testing function, which facilitates users to locate faults. 4. The interface settings are reasonable, the operation is convenient, and the various functional buttons are easy to find.
